US 12,341,142 B2
Electronic device and manufacturing method of electronic device
Shun-Yuan Hu, Miao-Li County (TW); and Chia-Chi Ho, Miao-Li County (TW)
Assigned to Innolux Corporation, Miaoli County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Jul. 28, 2022, as Appl. No. 17/876,508.
Claims priority of provisional application 63/233,334, filed on Aug. 16, 2021.
Claims priority of application No. 202210513602.1 (CN), filed on May 12, 2022.
Prior Publication US 2023/0052081 A1, Feb. 16, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 25/167 (2013.01) [H01L 21/6835 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16227 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A manufacturing method of an electronic device, comprising:
providing a first substrate comprising a plurality of chips;
providing a second substrate;
performing a transfer process to sequentially transfer a first chip and a second chip among the plurality of chips to the second substrate, wherein the second chip is adjacent to the first chip, a first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate, a second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate, and the first angle is different from the second angle, wherein the transfer process comprises rotating the first substrate, rotating the second substrate, or rotating a rotary disk of a robot arm;
forming a protective layer on the first chip and the second chip; and
forming a sealing member between a periphery of the second substrate and a periphery of the protective layer.