US 12,341,138 B2
Dual die integrated circuit system in an integrated circuit package with two separate supply domains
Paolo Marozzi, Freiburg (DE); and Ingo Freund, Freiburg (DE)
Assigned to TDK—Micronas GmbH, Freiburg (DE)
Filed by TDK—Micronas GmbH, Freiburg (DE)
Filed on Sep. 29, 2022, as Appl. No. 17/955,760.
Claims priority of application No. 10 2021 125 489.2 (DE), filed on Sep. 10, 2022.
Prior Publication US 2024/0088112 A1, Mar. 14, 2024
Int. Cl. H01L 23/495 (2006.01); G01D 5/14 (2006.01); G01R 33/00 (2006.01); G01R 33/07 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 25/16 (2013.01) [G01D 5/145 (2013.01); G01R 33/0094 (2013.01); G01R 33/072 (2013.01); H01L 21/4825 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 24/48 (2013.01); H01L 2224/48175 (2013.01); H01L 2924/19041 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A dual die integrated circuit (IC) system in an integrated circuit (IC) package with two separate supply domains, comprising:
a first die;
a second die;
a lead frame comprising a first ground pin (GND1), a first supply voltage (Vsup1), a second ground pin (GND2), and a second supply voltage (Vsup2), wherein the first die is connected to the first ground pin (GND1) and to the first supply voltage (Vsup1) and wherein the second die is connected to the second ground pin (GND2) and to the second supply voltage (Vsup2); and
at least one capacitive element (70) coupled between the first ground pin (GND1) and the second ground pin (GND2) and coupled between the first supply voltage (Vsup1) and the second supply voltage (Vsup2).