US 12,341,137 B2
Illumination devices using externally interconnected arrays of light emitting devices, and methods of fabricating same
Gerald H. Negley, Chapel Hill, NC (US); and Antony Paul Van de Ven, Sai Kung (HK)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CREELED, INC., Durham, NC (US)
Filed on Feb. 28, 2020, as Appl. No. 16/804,986.
Application 16/804,986 is a continuation of application No. 12/017,600, filed on Jan. 22, 2008, granted, now 10,586,787.
Claims priority of provisional application 60/986,795, filed on Nov. 9, 2007.
Claims priority of provisional application 60/982,909, filed on Oct. 26, 2007.
Claims priority of provisional application 60/885,937, filed on Jan. 22, 2007.
Prior Publication US 2020/0243492 A1, Jul. 30, 2020
Int. Cl. H01L 25/075 (2006.01); H01L 21/265 (2006.01); H05B 45/30 (2020.01); H05B 45/37 (2020.01); H05B 45/38 (2020.01); H10H 20/811 (2025.01); H10H 20/825 (2025.01); H10H 20/831 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01)
CPC H01L 25/0756 (2013.01) [H05B 45/30 (2020.01); H05B 45/37 (2020.01); H10H 20/811 (2025.01); H10H 20/825 (2025.01); H10H 20/831 (2025.01); H10H 20/8312 (2025.01); H10H 29/142 (2025.01); H01L 21/2654 (2013.01); H01L 2924/0002 (2013.01); H05B 45/38 (2020.01); H10H 20/8314 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A multiple light emitting diode (LED) chip, comprising:
a plurality of light emitting devices including a first light emitting device and a second light emitting device, wherein each light emitting device of the plurality of light emitting devices comprises:
a substrate portion that is electrically conductive;
one or more buffer layers over the substrate portion;
at least a first n-type layer,
at least a first active layer; and
at least a first p-type layer;
wherein the multiple LED chip comprises at least one isolation region configured to electrically isolate the first light emitting device from the second light emitting device, wherein the at least one isolation region comprises a solid insulating material that extends through the one or more buffer layers and the substrate portions, the solid insulating material comprising at least one of an oxide or a nitride; and
wherein the multiple LED chip comprises at least one conductive via extending through the solid insulating material of the at least one isolation region.