US 12,341,127 B2
Semifinished product for populating with components and, method for populating same with components
Nora Jeske, Berlin (DE); Bernd Müller, Falkenberg (DE); Christian Nachtigall-Schellenberg, Potsdam (DE); Jörg Strogies, Berlin (DE); and Klaus Wilke, Berlin (DE)
Assigned to SIEMENS AKTIENGESELLSCHAFT, Munich (DE)
Appl. No. 17/640,937
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Sep. 3, 2020, PCT No. PCT/EP2020/074517
§ 371(c)(1), (2) Date Mar. 7, 2022,
PCT Pub. No. WO2021/043855, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 10 2019 213 609.5 (DE), filed on Sep. 6, 2019; and application No. 10 2019 214 996.0 (DE), filed on Sep. 30, 2019.
Prior Publication US 2022/0336408 A1, Oct. 20, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01)
CPC H01L 24/83 (2013.01) [H01L 21/56 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/95 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/95 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semifinished product for use in populating of a power electronics component by a connecting method, the semifinished product comprising:
an electrically insulating prepreg frame configured to surround an applied connecting material at a metallized installation site to be subsequently populated with the power electronics component and connected by pressure sintering and/or soldering;
wherein a material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the prepreg frame since the processing parameters of the electrical connecting material and the semifinished product are compatible.