US 12,341,121 B2
Through-substrate underfill formation for an integrated circuit assembly
Eng Huat Goh, Ayer Itam (MY); Kyle Davidson, Hillsboro, OR (US); Min Suet Lim, Penang (MY); Kevin Byrd, Portland, OR (US); and James Wade, Hillsboro, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 7, 2020, as Appl. No. 17/113,410.
Prior Publication US 2022/0181289 A1, Jun. 9, 2022
Int. Cl. H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/52 (2006.01); H01L 23/64 (2006.01)
CPC H01L 24/32 (2013.01) [H01L 21/563 (2013.01); H01L 23/13 (2013.01); H01L 23/49833 (2013.01); H01L 23/642 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17135 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/19106 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic system, comprising:
an electronic board having a first surface and an opposing second surface, wherein the electronic board includes at least one opening extending from the first surface to the opposing second surface;
an integrated circuit package spanning the opening and electrically attached to the electronic board with a plurality of first interconnects laterally adjacent to the opening, wherein the integrated circuit package, comprises:
a package substrate having a first surface and an opposing second surface;
at least one integrated circuit die, wherein the at least one integrated circuit die is electrically attached to the package substrate with a plurality of second interconnects; and
a single body of underfill material between the first surface of the package substrate and the first surface of the electronic board, wherein a portion of the single body of underfill material extends into the opening in the electronic board and another portion of the single body of underfill material substantially surrounds individual ones of the first interconnects, wherein the electronic board has a recess extending therein from the first surface thereof, the recess extending between the opening and the plurality of first interconnects and filled with another portion of the single body of underfill.