	US 12,341,119 B2
	Method and material for attaching a chip to a submount
Zhengwei Shi, Houston, TX (US); Lijun Zhu, Dublin, CA (US); and Jihua Du, San Jose, CA (US)
Assigned to Lumentum Operations LLC, San Jose, CA (US)
Filed by Lumentum Operations LLC, San Jose, CA (US)
Filed on Jul. 21, 2022, as Appl. No. 17/814,004.
Application 17/814,004 is a division of application No. 16/815,659, filed on Mar. 11, 2020, granted, now 11,398,446.
Claims priority of provisional application 62/901,178, filed on Sep. 16, 2019.
Prior Publication US 2022/0359450 A1, Nov. 10, 2022
Int. Cl. H01L 23/00 (2006.01); B29C 35/08 (2006.01)

CPC H01L 24/29 (2013.01) [B29C 35/0805 (2013.01); B29C 2035/0827 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8384 (2013.01)]

20 Claims

1. A method, comprising:

heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin,

wherein the silver particles are un-sintered prior to the heating,

wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating, and

wherein at least a portion of the material is positioned between a chip and a submount; and

irradiating, with UV light, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.