US 12,341,106 B2
Package structure
Chun-Wen Lin, Changhua County (TW); Chung-Hao Tsai, Changhua County (TW); Chen-Hua Yu, Hsinchu (TW); Chuei-Tang Wang, Taichung (TW); and Che-Wei Hsu, Kaohsiung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Oct. 26, 2022, as Appl. No. 17/973,561.
Application 17/973,561 is a continuation of application No. 16/944,173, filed on Jul. 31, 2020, granted, now 11,488,909.
Application 16/944,173 is a continuation of application No. 15/900,808, filed on Feb. 21, 2018, granted, now 10,734,323, issued on Aug. 4, 2020.
Claims priority of provisional application 62/590,257, filed on Nov. 22, 2017.
Prior Publication US 2023/0043512 A1, Feb. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/18 (2013.01); H01L 2224/214 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/19106 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
at least one integrated circuit component, having a front side and comprising:
signal terminals and power terminals, distributed over the front side, wherein a size of each of the signal terminals is less than a size of each of the power terminals;
a first redistribution circuit structure, disposed over the front side of the at least one integrated circuit component and electrically connected to the at least one integrated circuit component through at least one of the signal terminals and the power terminals;
a second redistribution circuit structure, disposed over a rear side of the at least one integrated circuit component and electrically connected to the at least one integrated circuit component through the first redistribution circuit structure;
an encapsulant, located on the second redistribution circuit structure, wherein the second redistribution circuit structure is located between the at least one integrated circuit component and the encapsulant; and
antenna elements, located on the encapsulant, wherein the antenna elements are electrically coupled to the second redistribution circuit structure, and the encapsulant is located between the second redistribution circuit structure and the antenna elements.