US 12,341,070 B2
Apparatus match detection method, detection system, prewarning method, and prewarning system
Weigang Wang, Hefei (CN)
Assigned to CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Appl. No. 17/436,802
Filed by CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
PCT Filed Mar. 1, 2021, PCT No. PCT/CN2021/078509
§ 371(c)(1), (2) Date Jul. 12, 2022,
PCT Pub. No. WO2021/190248, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 202010215055.X (CN), filed on Mar. 24, 2020.
Prior Publication US 2022/0328364 A1, Oct. 13, 2022
Int. Cl. H01J 37/28 (2006.01); H01L 21/66 (2006.01)
CPC H01L 22/12 (2013.01) [H01J 37/28 (2013.01); H01L 22/20 (2013.01); H01J 2237/2817 (2013.01); H01J 2237/2826 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An apparatus match detection method, comprising:
providing a to-be-detected wafer, a first detection apparatus, and a second detection apparatus, the to-be-detected wafer comprising a first target detection area, a second target detection area, and a third target detection area, wherein the first target detection area and the second target detection area are independent of each other, and the third target detection area at least includes the first target detection area and the second target detection area;
measuring by the first detection apparatus a critical dimension of the first detection area to acquire a first detection result;
measuring by the second detection apparatus a critical dimension of the third detection area to acquire a third detection result;
measuring by the first detection apparatus a critical dimension of the second detection area to acquire a second detection result;
acquiring a measurement difference between the first detection apparatus and the second detection apparatus based on the first detection result, the second detection result, and the third detection result; and
acquiring a degree of deviation between the second detection apparatus and the first detection apparatus based on the measurement difference.