US 12,341,036 B2
Resin shaping device
Akira Yamauchi, Kyoto (JP)
Assigned to BONDTECH CO., LTD., Kyoto (JP)
Filed by BONDTECH CO., LTD., Kyoto (JP)
Filed on Jan. 20, 2023, as Appl. No. 18/157,147.
Application 18/157,147 is a division of application No. 16/484,450, granted, now 11,587,804, previously published as PCT/JP2018/003308, filed on Jan. 31, 2018.
Application 16/484,450 is a continuation of application No. PCT/JP2017/040651, filed on Nov. 10, 2017.
Application 16/484,450 is a continuation of application No. PCT/JP2018/001467, filed on Jan. 18, 2018.
Claims priority of application No. 2017-021953 (JP), filed on Feb. 9, 2017.
Prior Publication US 2023/0154770 A1, May 18, 2023
Int. Cl. H01L 21/67 (2006.01); B29C 35/08 (2006.01); B29C 45/14 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H05K 13/04 (2006.01); B29L 31/34 (2006.01)
CPC H01L 21/67144 (2013.01) [B29C 35/0805 (2013.01); B29C 45/14065 (2013.01); B29C 45/14655 (2013.01); H01L 21/02057 (2013.01); H01L 21/565 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67098 (2013.01); H01L 21/6715 (2013.01); H01L 21/67259 (2013.01); H01L 21/67742 (2013.01); H01L 21/681 (2013.01); H01L 21/6838 (2013.01); H01L 22/12 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H05K 13/0413 (2013.01); B29C 2035/0827 (2013.01); B29L 2031/3406 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75843 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81908 (2013.01); H05K 13/0409 (2018.08)] 17 Claims
OG exemplary drawing
 
1. A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising:
a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward;
a head configured to hold the mold from vertically below;
a head drive unit connected to the head configured to move the head to a position on the forming face for forming the resin part on the substrate, and the head drive unit configured to move the head vertically upward so that the head approaches the substrate holding unit, and presses the mold from vertically below the substrate;
a resin curing unit comprises an ultraviolet irradiation unit coupled to a support configured to cure the resin while the resin is placed in the mold in the state in which the mold is pressed against the substrate; and
a control unit that controls the head unit and the resin curing unit.