| CPC H01L 21/67103 (2013.01) [H01L 21/67248 (2013.01); H01L 21/6833 (2013.01)] | 17 Claims |
|
1. A support unit for supporting a substrate, the support unit comprising:
a support plate configured to support a substrate, and which includes an electrostatic electrode providing electrostatic force to the substrate;
a heater provided inside the support plate and configured to heat the substrate;
an insulating plate provided under the support plate as an insulating substance; and
a bimetal member disposed inside the support plate and configured to compensate for bending of the support plate due to heat,
wherein the bimetal member includes,
a pin provided to be contactable with a bottom surface of the substrate that is placed on the support plate;
a circular shaped first member configured to support the pin, the pin coupled to an upper surface of the circular shaped first member; and
a ring shaped second member provided to surround the circular shaped first member, and
the pin is provided to move up or move down according to a difference in the amount of thermal deformation between the circular shaped first member and the ring-shaped second member,
wherein a movement direction of the pin according to the difference in the amount of thermal deformation between the circular shaped first member and the ring-shaped second member is a direction opposite to a direction in which the support plate is bent according to a difference in the amount of thermal deformation between the support plate and the insulating plate in a region in which the bimetal member is provided.
|