US 12,341,029 B2
Wet clean apparatus for single wafer
Wenqian Xie, Shanghai (CN)
Assigned to Shanghai Huali Integrated Circuit Corporation, (CN)
Filed by Shanghai Huali Integrated Circuit Corporation, Shanghai (CN)
Filed on Mar. 21, 2023, as Appl. No. 18/187,135.
Claims priority of application No. 202210895538.8 (CN), filed on Jul. 27, 2022.
Prior Publication US 2024/0038552 A1, Feb. 1, 2024
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67063 (2013.01) [H01L 21/6704 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A wet clean apparatus for a single wafer, comprising:
a wafer bearing platform having a rotation function, used for placement of a wafer and rotation of the wafer;
an etchant injection apparatus used for injecting an etchant onto the surface of the wafer; and
a baffle arranged on the periphery of the wafer bearing platform;
the baffle comprising an anti-splash structure used for decelerating the etchant shaken off from the wafer;
the anti-splash structure comprising:
a first vertical plate, wherein the length direction of the first vertical plate is perpendicular to the surface of the wafer, and there is a spacing between the inner side surface of the first vertical plate and the wafer;
a first opening transversely passing through the first vertical plate, wherein the first opening is arranged on a movement track of the etchant shaken off from the surface of the wafer so that the etchant passes through the first opening; and
a second transverse plate, wherein a first end of the second transverse plate is fixedly arranged on the outer side surface of the first vertical plate; the top surface of the second transverse plate is horizontal and the top surface of the second transverse plate is lower than or flush with the bottom surface of the first opening, and the etchant passing through the first opening flows on the top surface of the second transverse plate so that the etchant undergoes a first time of deceleration.