US 12,341,014 B2
Multi-faced molded semiconductor package and related methods
Eiji Kurose, Oizumi-machi (JP)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Apr. 5, 2022, as Appl. No. 17/658,071.
Application 17/658,071 is a division of application No. 16/702,958, filed on Dec. 4, 2019, granted, now 11,328,930.
Application 16/702,958 is a division of application No. 15/679,661, filed on Aug. 17, 2017, granted, now 10,529,576, issued on Jan. 7, 2020.
Prior Publication US 2022/0230885 A1, Jul. 21, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/302 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01)
CPC H01L 21/302 (2013.01) [H01L 21/48 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/12 (2013.01); H01L 23/3185 (2013.01); H01L 24/04 (2013.01); H01L 24/26 (2013.01); H01L 2224/94 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a die comprising a first side, a second side, a third side, a fourth side, a fifth side, and a sixth side, the first side of the die comprising a plurality of electrical contacts comprising a plurality of bumps;
a first mold compound covering the first side of the die, the second side of the die, the third side of the die, the fourth side of the die, and the fifth side of the die, wherein the plurality of bumps extend through a plurality of openings in the first mold compound;
a solder resist layer directly coupled to the first side of the die;
a passivation layer coupled between the solder resist layer and the first mold compound; and
one of a second mold compound or a laminate resin covering the sixth side of the die;
wherein the first mold compound is a single and continuous mold compound;
wherein the plurality of bumps are directly coupled to and over an outer surface of the first mold compound; and
wherein the plurality of bumps are configured to contact an external device.