US 12,341,008 B2
Heat treatment device and treatment method
Yohei Sano, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Apr. 4, 2024, as Appl. No. 18/626,475.
Application 18/626,475 is a division of application No. 17/948,707, filed on Sep. 20, 2022, granted, now 11,978,630.
Application 17/948,707 is a division of application No. 16/934,097, filed on Jul. 21, 2020, granted, now 11,469,105, issued on Sep. 21, 2022.
Claims priority of application No. 2019-134446 (JP), filed on Jul. 22, 2019; and application No. 2019-224598 (JP), filed on Dec. 12, 2019.
Prior Publication US 2024/0249940 A1, Jul. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/027 (2006.01); G03F 7/09 (2006.01); G03F 7/20 (2006.01); H01L 21/02 (2006.01); H01L 21/324 (2006.01); H05B 3/26 (2006.01)
CPC H01L 21/0274 (2013.01) [G03F 7/09 (2013.01); G03F 7/20 (2013.01); H01L 21/02104 (2013.01); H01L 21/324 (2013.01); H05B 3/262 (2013.01); H05B 2203/022 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A heat treatment device comprising:
a heating plate configured to support and heat a substrate on which a metal containing resist film is formed;
a chamber configured to cover a processing space above the heating plate;
a gas supply configured to supply a gas into the chamber along a gas flow path connected to an inside of the chamber, the gas flow path being directed toward the substrate; and
an exhaust port configured to evacuate the inside of the chamber.
 
6. A heat treatment method comprising:
providing a heating plate in a chamber, the heating plate being configured to support and heat a substrate formed with a resist film; and
performing a heat treatment on the substrate while injecting a processing gas to a processing space on the heating plate, supplying a gas into the chamber from below a surface of the substrate, and evacuating an inside of the chamber through an exhaust hole formed above the processing space within the chamber.
 
7. A non-transitory computer-readable storage medium having stored therein a program that causes a computer to execute the heat treatment method according to claim 6.