US 12,340,991 B2
Substrate fixing device
Aya Uchiyama, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jun. 22, 2023, as Appl. No. 18/339,591.
Claims priority of application No. 2022-102210 (JP), filed on Jun. 24, 2022.
Prior Publication US 2023/0420231 A1, Dec. 28, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32724 (2013.01) [H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate fixing device comprising:
a base plate;
a heat-generating part provided on the base plate via an adhesive layer; and
an electrostatic chuck provided on the heat-generating part and configured to adsorb and hold a target object to be adsorbed,
wherein the heat-generating part comprises:
a first insulating layer having a first surface and a second surface opposite to the first surface, the first surface being in contact with the electrostatic chuck,
a heat-generating element arranged on the second surface of the first insulating layer, and
a second insulating layer stacked on the second surface of the first insulating layer and covering the heat-generating element,
wherein a through-hole penetrating through the base plate, the adhesive layer, and the second insulating layer and exposing a part of the heat-generating element is provided, and
wherein a glass transition temperature of the second insulating layer is higher than a glass transition temperature of the first insulating layer.