US 12,340,983 B2
Apparatus for treating substrate and method for treating substrate
Dong-Hun Kim, Seoul (KR); Wan Jae Park, Hwaseong-si (KR); Ji Hoon Park, Suwon-si (KR); and Du Ri Kim, Incheon (KR)
Assigned to Semes Co., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on May 24, 2022, as Appl. No. 17/752,079.
Claims priority of application No. 10-2021-0066569 (KR), filed on May 25, 2021.
Prior Publication US 2022/0384153 A1, Dec. 1, 2022
Int. Cl. H01J 37/32 (2006.01); H01J 61/30 (2006.01); H01J 65/04 (2006.01)
CPC H01J 37/32522 (2013.01) [H01J 37/32422 (2013.01); H01J 37/3244 (2013.01); H01J 61/302 (2013.01); H01J 65/042 (2013.01); H01J 37/3222 (2013.01); H01J 2237/335 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a chamber having an inner space;
a plasma source configured to apply an electric field;
a first gas supply unit configured to supply a first process gas to a region to which the plasma source applies the electric field, the first process gas excited to a plasma when the first process gas is applied with an electric field of a first intensity at a first pressure atmosphere;
a support unit disposed in the inner space and configured to support a substrate to be treated; and
an electrodeless lamp disposed above the substrate in the inner space, and
wherein the electrodeless lamp comprises:
an electric field transmissive housing having a discharging space therein; and
a discharging material including a luminous material and filling the discharging space, the discharging space of the housing being pressurized to a second pressure, and the discharging material discharging and luminating when applied with an electric field of a second intensity higher than the first intensity at a second pressure.