US 12,340,949 B2
Multilayer ceramic electronic device, circuit substrate and manufacturing method of multilayer ceramic electronic device
Yasuyuki Inomata, Tokyo (JP); Tetsuo Shimura, Tokyo (JP); and Masaki Mochigi, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Apr. 12, 2023, as Appl. No. 18/299,520.
Claims priority of application No. 2022-073403 (JP), filed on Apr. 27, 2022.
Prior Publication US 2023/0352245 A1, Nov. 2, 2023
Int. Cl. H01G 4/232 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic device comprising:
a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers that face each other and are stacked together with the plurality of dielectric layers interposed therebetween, one end of each of the plurality of internal electrode layers being exposed from the multilayer chip; and
an external electrode that is provided on an end face of the multilayer chip and is electrically connected to the one end of at least some of the plurality of internal electrode layers and includes a glass component, the end face being an end of the multilayer chip in a direction in which the plurality of internal electrode layers extend,
wherein the external electrode includes a crystal extending into the glass component at an interface between the external electrode and the end face of the multilayer chip, and
wherein the crystal includes an element that is the same as at least one of elements included in the plurality of dielectric layers.