US 12,340,946 B2
Multilayer electronic component
Sin Il Gu, Suwon-si (KR); and Jin Hyung Lim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 6, 2023, as Appl. No. 18/106,127.
Claims priority of application No. 10-2022-0151972 (KR), filed on Nov. 14, 2022.
Prior Publication US 2024/0161980 A1, May 16, 2024
Int. Cl. H01G 4/232 (2006.01); H01G 4/005 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/005 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including:
first and second surfaces opposing each other in a first direction,
third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction,
fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction,
a capacitance formation portion in which a dielectric layer and an internal electrode are alternately disposed in the first direction,
cover portions respectively including dielectric layers disposed on surfaces of the capacitance formation portion opposing each other in the first direction, and
margin portions respectively including dielectric layers disposed on surfaces of the capacitance formation portion opposing each other in the third direction;
a first external electrode including:
a first connection portion disposed on the third surface, and
a first band portion disposed to extend from the first connection portion to a portion of the first surface; and
a second external electrode including:
a second connection portion disposed on the fourth surface, and
a second band portion disposed to extend from the second connection portion to a portion of the first surface,
wherein:
the cover portions include:
a first-first buffer layer connected to the first external electrode, and
a first-second buffer layer connected to the second external electrode, the margin portions include:
a second-first buffer layer connected to the first external electrode, and
a second-second buffer layer connected to the second external electrode,
the first-first buffer layer and the second-first buffer layer are connected to each other,
the first-second buffer layer and the second-second buffer layer are connected to each other, and
portions of the dielectric layers in which the first-first buffer layer and the first-second buffer layer are disposed extend to an outermost surface of the body in the first direction, or portions of the dielectric layers in which the second-first buffer layer and the second-second buffer layer are disposed extend to an outermost surface of the body in the third direction.