	US 12,340,945 B2
	Multilayer electronic component
Jin Soo Park, Suwon-si (KR); Eui Hyun Jo, Suwon-si (KR); Jun Hyeong Kim, Suwon-si (KR); Ha Jeong Kim, Suwon-si (KR); Hyun Hee Gu, Suwon-si (KR); Woo Kyung Sung, Suwon-si (KR); Myung Jun Park, Suwon-si (KR); Byung Jun Jeon, Suwon-si (KR); and Chul Seung Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 14, 2022, as Appl. No. 18/081,079.
Claims priority of application No. 10-2022-0008472 (KR), filed on Jan. 20, 2022; and application No. 10-2022-0067773 (KR), filed on Jun. 2, 2022.
Prior Publication US 2023/0230765 A1, Jul. 20, 2023
Int. Cl. H01G 4/232 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)

CPC H01G 4/2325 (2013.01) [H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01)]

20 Claims

1. A multilayer electronic component comprising:

a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween; and

external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy,

wherein a Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.