| CPC H01F 27/363 (2020.08) [H01F 27/2885 (2013.01)] | 17 Claims |

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1. An apparatus comprising:
a substrate having a vertical stack of at least first, second, third, and fourth metal layers, the substrate including:
a first coil having at least a first loop in the first metal layer and at least a second loop in the second metal layer;
a second coil having at least a third loop on the third metal layer and at least a fourth loop in the fourth metal layer;
a first shield layer in the second metal layer; and
a second shield layer in the third metal layer.
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