US 12,340,924 B2
Integrated flexible circuit attachment features with sound dampening and method of forming said features
David R. Peterson, Aurora, OH (US); Joseph Sudik, Jr., Niles, OH (US); Jesse Braun, Bentleyville, OH (US); and David Siegfried, Warren, OH (US)
Assigned to Aptiv Technologies AG, Schaffhausen (CH)
Filed by Aptiv Technologies AG, Schaffhausen (CH)
Filed on Nov. 29, 2022, as Appl. No. 18/071,183.
Claims priority of provisional application 63/285,281, filed on Dec. 2, 2021.
Claims priority of provisional application 63/285,277, filed on Dec. 2, 2021.
Prior Publication US 2023/0178264 A1, Jun. 8, 2023
Int. Cl. H01B 7/08 (2006.01); H01B 19/02 (2006.01); H01B 19/04 (2006.01)
CPC H01B 7/0823 (2013.01) [H01B 19/02 (2013.01); H01B 19/04 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A wiring assembly, comprising:
a flex circuit including a first surface and a second surface with a conductive layer positioned therebetween, and a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate, the mount location including a through-hole; and
a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location, the extruded material forming a perimeter around the through-hole, wherein the flex circuit attachment feature includes an engagement surface configured to be in direct contact with the fastener,
wherein the flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate,
wherein the fastener includes a stud having a projection that directly contacts the engagement surface of the extruded material.