US 12,340,719 B2
Chip-on-film package, display panel, and display device
Hee-Kwon Lee, Asan-si (KR); and Seungkyun Hong, Cheonan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Sep. 1, 2023, as Appl. No. 18/241,712.
Application 18/241,712 is a continuation of application No. 17/367,574, filed on Jul. 5, 2021, granted, now 11,749,146.
Application 17/367,574 is a continuation of application No. 16/692,122, filed on Nov. 22, 2019, granted, now 11,056,027.
Application 16/692,122 is a continuation of application No. 15/857,744, filed on Dec. 29, 2017, granted, now 10,504,830, issued on Dec. 10, 2019.
Claims priority of application No. 10-2017-0018734 (KR), filed on Feb. 10, 2017.
Prior Publication US 2023/0410703 A1, Dec. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G09G 3/00 (2006.01); G02F 1/1345 (2006.01); G09G 3/20 (2006.01); H01L 23/31 (2006.01); H01L 23/482 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC G09G 3/006 (2013.01) [G02F 1/13452 (2013.01); G09G 3/20 (2013.01); H01L 23/3114 (2013.01); H01L 23/4824 (2013.01); H01L 23/4985 (2013.01); H05K 1/0268 (2013.01); G09G 2300/0413 (2013.01); G09G 2300/0426 (2013.01); G09G 2330/12 (2013.01); H05K 1/028 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A chip-on-film package comprising:
a base substrate on which a first pad region extends on a first side defining one side of the base substrate, a second pad region extending on a second side defining an opposite side of the base substrate to the one side of the base substrate, a third pad region located between the first pad region and the second pad region, a first region located between the first pad region and the third pad region, and a second region located between the third pad region and the second pad region are defined;
a plurality of first-pads and a first dummy-pad disposed on the first pad region;
a plurality of second-pads and a second dummy-pad disposed on the second pad region;
a plurality of third-pads and a third dummy pad disposed on the third pad region;
a first detection line disposed on the base substrate, wherein the first detection line includes a first sub-detection line connected between a first third-pad of the third-pads and a first first-pad of the first-pads, a second sub-detection line connected between a second third-pad of the third-pads and a second first-pad of the first-pads, a third sub-detection line connected between the second sub-detection line and a third first-pad of the first-pads, a fourth sub-detection line connected between a third third-pad of the third-pads and a fourth first-pad of the first-pads, and a fifth sub-detection line connected between a fourth third-pad of the third-pads and the fourth sub-detection line, the first first-pad being connected to the third first-pad in the first pad region, and the second first-pad being connected to the fourth first-pad in the first pad region, a second detection line disposed on the base substrate, wherein the second detection line is connected between the third dummy pad and the first sub-detection line;
wherein the first first-pad is connected to the third first-pad through a short pad in the first pad region and the first dummy-pad is floating.