US 12,340,495 B2
Method for computational metrology and inspection for patterns to be manufactured on a substrate
Linyong Pang, Monte Sereno, CA (US); Jocelyn Blair, Campbell, CA (US); and Ajay Baranwal, Dublin, CA (US)
Assigned to D2S, Inc., San Jose, CA (US)
Filed by D2S, Inc., San Jose, CA (US)
Filed on Aug. 2, 2022, as Appl. No. 17/816,910.
Claims priority of provisional application 63/260,039, filed on Aug. 6, 2021.
Prior Publication US 2023/0037918 A1, Feb. 9, 2023
Int. Cl. G06T 7/00 (2017.01); G03F 1/84 (2012.01); G06N 3/045 (2023.01); G06T 7/70 (2017.01)
CPC G06T 7/0004 (2013.01) [G03F 1/84 (2013.01); G06N 3/045 (2023.01); G06T 7/70 (2017.01); G06T 2207/10032 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for determining a scanner aerial image from a mask inspection image, the method comprising:
inputting the mask inspection image, wherein the mask inspection image has been generated by a mask inspection machine; and
generating the scanner aerial image from the mask inspection image using a neural network.