US 12,340,265 B2
Method for producing a chip card body
Thorsten Sauer, Erding (DE); Michael Baldischweiler, Munich (DE); and Thomas Tarantino, Laufen (DE)
Assigned to GIESECKE+DEVRIENT EPAYMENTS GMBH, Munich (DE)
Appl. No. 18/569,907
Filed by GIESECKE+DEVRIENT EPAYMENTS GMBH, Munich (DE)
PCT Filed Jun. 24, 2022, PCT No. PCT/EP2022/025290
§ 371(c)(1), (2) Date Dec. 13, 2023,
PCT Pub. No. WO2023/274575, PCT Pub. Date Jan. 5, 2023.
Claims priority of application No. 10 2021 003 336.1 (DE), filed on Jun. 29, 2021.
Prior Publication US 2024/0273328 A1, Aug. 15, 2024
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07718 (2013.01) [G06K 19/07722 (2013.01); G06K 19/07749 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for producing a chip card body having a metallic core layer for a contactless or dual-interface chip card, comprising the steps of:
providing a metallic multiple-copy metal sheet for a plurality of metallic core layers;
generating a corresponding plurality of cavities for fixing a corresponding plurality of chip modules;
extracting the plurality of metallic core layers from the provided metallic multiple-copy sheet; and later
generating at least one slot in one of the plurality of metallic core layers extracted from the metallic multiple-copy sheet.