US 12,340,055 B2
Method of fabricating electronic apparatus having contact holes penetrating at least one different insulating layer in different regions
Yanghee Kim, Yongin-si (KR); Jeongho Lee, Seoul (KR); Won Ho Kim, Seongnam-si (KR); Soyeon Park, Seoul (KR); Dong-Hyun Lee, Suwon-si (KR); and Hyungchul Lim, Cheonan-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Feb. 18, 2024, as Appl. No. 18/444,756.
Application 18/444,756 is a division of application No. 16/869,432, filed on May 7, 2020, granted, now 11,934,620.
Claims priority of application No. 10-2019-0055215 (KR), filed on May 10, 2019.
Prior Publication US 2024/0256092 A1, Aug. 1, 2024
Int. Cl. G06F 3/044 (2006.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC G06F 3/0445 (2019.05) [G06F 3/0446 (2019.05); H10D 86/021 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); G06F 2203/04103 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method of fabricating an electronic apparatus, the method comprising:
forming a circuit element on a base substrate;
forming a signal line on the base substrate;
forming a first insulating layer covering the circuit element and the signal line;
forming a display device layer on the first insulating layer, the display device layer comprising a light-emitting device;
forming a first conductive layer on the display device layer;
forming a second insulating layer covering the first insulating layer and the first conductive layer;
forming a first contact hole in a first region overlapping with the first conductive layer, the first contact hole penetrating the second insulating layer;
forming a second contact hole in a second region overlapping with an end portion of the signal line, the second contact hole penetrating the first and second insulating layers;
forming a second conductive layer overlapping with the first region; and
forming a pad overlapping with the second region.