US 12,339,714 B2
Housings for electronic devices
Chi Hao Chang, Taipei (TW); Hendry Huang, Taipei (TW); and Kuan-Ting Wu, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 18/011,493
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jul. 27, 2020, PCT No. PCT/US2020/043667
§ 371(c)(1), (2) Date Dec. 19, 2022,
PCT Pub. No. WO2022/025859, PCT Pub. Date Feb. 3, 2022.
Prior Publication US 2023/0259179 A1, Aug. 17, 2023
Int. Cl. G06F 1/00 (2006.01); G06F 1/16 (2006.01); H01Q 1/22 (2006.01); H01Q 1/40 (2006.01)
CPC G06F 1/1698 (2013.01) [G06F 1/1656 (2013.01); H01Q 1/22 (2013.01); H01Q 1/40 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A housing for an electronic device comprising:
a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate;
a conductive metal antenna conformally carried by the recessed region to and positioned at the opening; and
a filler layer on the conductive metal antenna over the recessed region.