US 12,339,637 B2
Optimizing semiconductor manufacturing processes using machine learning
Ryan Stoddard, Shoreline, WA (US)
Assigned to Delta Design, Inc., Poway, CA (US)
Filed by Tignis, Inc., Seattle, WA (US)
Filed on May 10, 2024, as Appl. No. 18/661,276.
Claims priority of provisional application 63/501,834, filed on May 12, 2023.
Prior Publication US 2024/0377802 A1, Nov. 14, 2024
Int. Cl. G05B 19/18 (2006.01)
CPC G05B 19/188 (2013.01) [G05B 2219/45031 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A computer-implemented method of controlling a semiconductor manufacturing process, the method comprising:
generating, by a computing system, predicted metrology values for a current run and predicted metrology values for a next run by providing metrology forecast inputs associated with the current run to a metrology forecast model;
providing, by the computing system, at least the predicted metrology values for the current run and the next run to an actor model to generate an updated recipe for executing at least one semiconductor manufacturing process step; and
using the updated recipe to control at least one manufacturing device during the at least one semiconductor manufacturing process step.