US 12,339,588 B2
High force low voltage piezoelectric micromirror actuator
Luc Roger Simonne Haspeslagh, Linden (BE); Nitesh Pandey, Silicon Valley, CA (US); Ties Wouter Van Der Woord, Eindhoven (NL); Halil Gökay Yeǧen, Eindhoven (NL); Guilherme Brondani Torri, Leuven (BE); Sebastianus Adrianus Goorden, Eindhoven (NL); Alexander Ludwig Klein, Eindhoven (NL); Jim Vincent Overkamp, Eindhoven (NL); and Edgar Alberto Osorio Oliveros, Eindhoven (NL)
Assigned to ASML Netherlands B.V., Veldhoven (NL)
Appl. No. 18/038,601
Filed by ASML Netherlands B.V., Veldhoven (NL)
PCT Filed Nov. 12, 2021, PCT No. PCT/EP2021/081584
§ 371(c)(1), (2) Date May 24, 2023,
PCT Pub. No. WO2022/112027, PCT Pub. Date Jun. 2, 2022.
Claims priority of application No. 20210517 (EP), filed on Nov. 30, 2020; and application No. 20213659 (EP), filed on Dec. 14, 2020.
Prior Publication US 2024/0012332 A1, Jan. 11, 2024
Int. Cl. G03F 7/00 (2006.01); G02B 26/08 (2006.01); H02N 2/00 (2006.01); H02N 2/10 (2006.01); H10N 30/05 (2023.01); H10N 30/50 (2023.01)
CPC G03F 7/70116 (2013.01) [G02B 26/0858 (2013.01); G03F 7/7015 (2013.01); G03F 7/70625 (2013.01); G03F 7/706849 (2023.05); H02N 2/009 (2013.01); H02N 2/108 (2013.01); H10N 30/05 (2023.02); H10N 30/50 (2023.02)] 13 Claims
OG exemplary drawing
 
1. A microelectromechanical system, MEMS, comprising:
a substrate;
a plurality of MEMS elements;
for each MEMS element of the plurality of MEMS elements, at least one multilayer piezoelectric actuator configured to displace the MEMS element and connected to the substrate; and
one or more pillars connecting the MEMS element to the at least one multilayer piezoelectric actuator,
wherein the at least one multilayer piezoelectric actuator comprises a plurality of piezoelectric layers of piezoelectric material interleaved with a plurality of electrode layers to form a stack of layers,
wherein the at least one multilayer piezoelectric actuator comprises a strip of flexible material connected at a first end to the substrate and at a second end to a respective one of the one or more pillars,
wherein the stack of layers is connected to the strip of flexible material and is configured to cause the strip to bend during use,
wherein the at least one multilayer piezoelectric actuator comprises a hinge connected to one of the first or second ends of the strip of flexible material and to the respective one of the one or more pillars, and wherein the hinge has a smaller cross section than the strip of flexible material in an elongation direction of the strip, and
wherein the at least one multilayer piezoelectric actuator is disposed between the MEMS element and the substrate.