US 12,339,572 B2
Heat dissipating module and projection device
Shi-Wen Lin, Hsin-Chu (TW); Wei-Chi Liu, Hsin-Chu (TW); and Tsung-Ching Lin, Hsin-Chu (TW)
Assigned to Coretronic Corporation, Hsin-Chu (TW)
Filed by Coretronic Corporation, Hsin-Chu (TW)
Filed on Aug. 2, 2022, as Appl. No. 17/878,919.
Claims priority of application No. 202110879005.6 (CN), filed on Aug. 2, 2021.
Prior Publication US 2023/0033834 A1, Feb. 2, 2023
Int. Cl. G03B 21/16 (2006.01); H05K 7/20 (2006.01)
CPC G03B 21/16 (2013.01) [H05K 7/20272 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A heat dissipating module, comprising a casing, a cover plate, a pressurizing device, a water pump, and a stop valve, wherein:
the casing comprises a bottom plate and a water inlet;
the cover plate is disposed on a side of the casing opposite to the bottom plate;
the pressurizing device moves back and forth in the casing and has a maximum stroke;
the water pump is disposed between the bottom plate and the pressurizing device, wherein liquid fills a space between the water pump and the pressurizing device to define a water tank; and
the stop valve is disposed in the water tank and located between the pressurizing device and the water pump, wherein the maximum stroke of the pressurizing device is a distance between the cover plate and the stop valve, and according to a direction from the bottom plate to the cover plate, the water inlet is disposed at a first height, the stop valve is disposed at a second height, and the first height is lower than the second height.