US 12,339,178 B2
Mechanism for assembling force sensor patch into earphone device
Chih-Ming Sun, Hsin-Chu (TW); and Yen-Po Chen, Hsin-Chu (TW)
Assigned to PixArt Imaging Inc., Hsin-Chu (TW)
Filed by PixArt Imaging Inc., Hsin-Chu (TW)
Filed on Feb. 24, 2022, as Appl. No. 17/680,232.
Application 17/680,232 is a continuation in part of application No. 17/235,664, filed on Apr. 20, 2021, granted, now 11,761,830.
Application 17/235,664 is a continuation in part of application No. 17/130,103, filed on Dec. 22, 2020, granted, now 11,733,109.
Application 17/130,103 is a continuation of application No. 16/247,573, filed on Jan. 15, 2019, granted, now 10,921,199, issued on Feb. 16, 2021.
Claims priority of provisional application 63/165,736, filed on Mar. 24, 2021.
Prior Publication US 2022/0307925 A1, Sep. 29, 2022
Int. Cl. G01L 1/14 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01)
CPC G01L 1/144 (2013.01) [H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 2201/10151 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An earphone device, comprising:
a housing subassembly;
an inner casing subassembly, disposed in the housing subassembly and integrated with a printed circuit board having at least one specific electrode;
an audio processor, disposed on the printed circuit board; and
a force sensor patch, pasted onto the at least one specific electrode of the printed circuit board to be coupled to the audio processor through the at least one specific electrode;
wherein the force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly;
and, the force sensor patch comprises:
a top electrically conductive layer portion at a top surface;
an intermediate dielectric layer portion;
a compressible conductive portion, coupled to a bottom of the top electrically conductive layer portion; and
a bottom electrically conductive layer portion, coupled to a bottom of the intermediate dielectric layer portion;
wherein the compressible conductive portion is adhered to a second electrode of the printed circuit board, and the bottom electrically conductive layer portion is adhered to a first electrode of the printed circuit board.