US 12,339,067 B2
Thin-plate loop heat pipe
Yongbin Mu, Suzhou (CN); and Xiuhong Zhao, Suzhou (CN)
Assigned to ShengRongYuan(Suzhou) Technology Co., Ltd, Suzhou (CN)
Appl. No. 18/279,870
Filed by ShengRongYuan(Suzhou) Technology Co., Ltd, Suzhou (CN)
PCT Filed Nov. 26, 2021, PCT No. PCT/CN2021/133542
§ 371(c)(1), (2) Date Aug. 31, 2023,
PCT Pub. No. WO2022/183793, PCT Pub. Date Sep. 9, 2022.
Claims priority of application No. 202110222991.8 (CN), filed on Mar. 1, 2021; and application No. 202120431012.5 (CN), filed on Mar. 1, 2021.
Prior Publication US 2024/0044582 A1, Feb. 8, 2024
Int. Cl. F28D 15/00 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28D 21/00 (2006.01)
CPC F28D 15/0266 (2013.01) [F28D 15/043 (2013.01); F28D 2021/0029 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A thin-plate loop heat pipe, comprising a housing (1), wherein the housing (1) comprises a first housing plate (11) and a second housing plate (12) that are relatively covered and sealed together at edges,
wherein an evaporation chamber (2), a vapor channel (3), a condensation chamber (4), a liquid channel (5), a compensation chamber (6) and an auxiliary fluid channel (7) are formed between the first housing plate (11) and the second housing plate (12),
wherein a first capillary structure (21) is provided in the evaporation chamber (2) to form a first vapor chamber (22) and a second vapor chamber (23) located between the first vapor chamber (22) and the compensation chamber (6),
wherein the first vapor chamber (22) and the condensation chamber (4) communicate with each other by the vapor channel (3), the condensation chamber (4) and the compensation chamber (6) communicate with each other by the liquid channel (5), and the second vapor chamber (23) and the condensation chamber (4) communicate with each other by the auxiliary fluid channel (7),
wherein the first vapor chamber (22) is configured to evaporate a first liquid-phase working medium in the first vapor chamber (22) into a first vaporized working medium when heated by a heat source (202), and to pass the first vaporized working medium through the vapor channel (3) to the condensation chamber (4),
wherein the second vapor chamber (23) is configured to evaporate a second liquid-phase working medium in the second vapor chamber (23) into a second vaporized working medium when receiving heat leaked from the first vapor chamber (22), and to pass the second vaporized working medium through the auxiliary fluid channel (7) to the condensation chamber (4), thereby reducing a heat transfer temperature difference of the thin-plate loop heat pipe, and
wherein the condensation chamber (4) is configured to condense the first vaporized working medium into a first condensed working medium and the second vaporized working medium into a second condensed working medium within the same condensation chamber (4), and to pass the first condensed working medium and the second condensed working medium to the compensation chamber (6) through the liquid channel (5).