US 12,338,523 B2
Method for patterning a substrate, a method for forming a microstructure on a substrate, and a method for fabricating a fluidic device
Keishu Tsuda, Nagoya (JP)
Assigned to CRAIF INC., Tokyo (JP)
Appl. No. 18/682,253
Filed by CRAIF INC., Tokyo (JP)
PCT Filed Aug. 8, 2022, PCT No. PCT/JP2022/030233
§ 371(c)(1), (2) Date Feb. 8, 2024,
PCT Pub. No. WO2023/017801, PCT Pub. Date Feb. 16, 2023.
Claims priority of application No. 2021-131490 (JP), filed on Aug. 11, 2021.
Prior Publication US 2024/0376587 A1, Nov. 14, 2024
Int. Cl. C23C 14/04 (2006.01); B01L 3/00 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01)
CPC C23C 14/042 (2013.01) [B01L 3/502707 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/5853 (2013.01); B01L 2200/0647 (2013.01); B01L 2200/12 (2013.01); B01L 2300/12 (2013.01); B01L 2300/161 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for patterning a target material over a substrate, comprising:
providing a substrate;
forming a hydrophobic film on a surface of the substrate;
patterning the hydrophobic film to expose a portion of the surface of the substrate;
applying a target material to the portion of the surface of the substrate exposed by the patterning such that the hydrophobic film is exposed at another portion of the surface of the substrate;
oxidizing the target material on the substrate;
forming a microstructure on a surface of the oxidized target material before removing the hydrophobic film; and
removing the hydrophobic film after said forming of the microstructure.