US 12,338,357 B2
Photosensitive composition
Tomohiro Fukuura, Osaka (JP); Yoshihiro Harada, Osaka (JP); Yoshifumi Komatsu, Osaka (JP); and Masayoshi Tokuda, Osaka (JP)
Assigned to SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo (JP)
Appl. No. 17/787,288
Filed by SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo (JP)
PCT Filed Dec. 23, 2020, PCT No. PCT/JP2020/048162
§ 371(c)(1), (2) Date Jun. 17, 2022,
PCT Pub. No. WO2021/132333, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-237347 (JP), filed on Dec. 26, 2019.
Prior Publication US 2023/0034267 A1, Feb. 2, 2023
Int. Cl. C09D 11/52 (2014.01); C09D 11/03 (2014.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/38 (2014.01); G02B 5/20 (2006.01)
CPC C09D 11/52 (2013.01) [C09D 11/03 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 11/38 (2013.01); G02B 5/20 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A photosensitive composition comprising a semiconductor particle (A), a photopolymerizable compound (C), a photopolymerization initiator (D), a stabilizer (E) and a solvent (F), wherein
a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition, wherein a content of the photopolymerizable compound (C) is 40% by mass or more based on the total amount of the photosensitive composition, and
a content of the solvent (F) is 0.5% mass or more and 3.5% by mass or less based on the total amount of the photosensitive composition.