| CPC C08K 5/5317 (2013.01) [C08K 5/521 (2013.01); G02B 5/208 (2013.01); G02B 5/22 (2013.01); G02B 5/223 (2013.01); G03B 11/00 (2013.01); C08K 3/32 (2013.01); C08K 2003/329 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01)] | 11 Claims |

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1. A composition comprising:
a compound including a copper ion and a phosphonic acid represented by following formula (a);
a phosphoric acid ester including at least one selected from the group consisting of a phosphoric acid diester represented by following formula (b1) and a phosphoric acid monoester represented by following formula (b2);
a phosphoric acid; and
a curable resin,
![]() where R1 is an alkyl group with 2 to 4 carbon atoms, R21, R22 and R3 are each a monovalent functional group represented by —(CH2CH2)nR4, n is an integer of 1 to 25, R4 is an alkyl group with 6 to 25 carbon atoms, and R21, R22 and R3 are same or different group,
wherein a ratio of a content of the phosphoric acid to a content of the copper ion is 0.04 to 0.21 on a molar basis,
wherein a ratio Ca/Cc of a content of the phosphonic acid to a total content of the phosphoric acid ester is 2.5 or less on a molar basis, and
wherein a ratio of a total content of a phosphorus atom to a content of the copper ion is 1.29 to 1.51 on a molar basis.
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