US 12,338,315 B2
Epoxy resin composition, prepreg, and fiber reinforced composite material
Koji Furukawa, Iyo-gun (JP); Kentaro Sano, Iyo-gun (JP); and Junko Kawasaki, Ehime (JP)
Assigned to TORAY INDUSTRIES, INC., Tokyo (JP)
Appl. No. 17/772,574
Filed by TORAY INDUSTRIES, INC., Tokyo (JP)
PCT Filed Nov. 5, 2020, PCT No. PCT/JP2020/041333
§ 371(c)(1), (2) Date Apr. 28, 2022,
PCT Pub. No. WO2021/095627, PCT Pub. Date May 20, 2021.
Claims priority of application No. 2019-206896 (JP), filed on Nov. 15, 2019.
Prior Publication US 2023/0037333 A1, Feb. 9, 2023
Int. Cl. C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); C08K 5/053 (2006.01); C08K 5/07 (2006.01); C08K 5/20 (2006.01)
CPC C08G 59/245 (2013.01) [C08G 59/5033 (2013.01); C08J 5/042 (2013.01); C08J 5/243 (2021.05); C08K 5/053 (2013.01); C08K 5/07 (2013.01); C08K 5/20 (2013.01); C08J 2363/00 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An epoxy resin composition comprising the following components [A] to [C]:
[A]: epoxy resin;
[B]: aromatic diamine; and
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in a molecule and having substantially no ability to cure an epoxy resin,
and satisfying the following conditions (1) to (5):
(1) a ratio H/E between an amount by mole, E, of epoxy groups in the component [A] and an amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less;
(2) at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M between the molecular weight m thereof and a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition;
(3) a ratio C/E between an amount by mole, E, of epoxy groups of the component [A] and an amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less;
(4) the epoxy resin composition has a viscosity after being held at 70° C. for 2 hours that is 5.0 times or less than an initial viscosity at 70° C.; and
(5) a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition is 400 or less.