US 12,337,501 B2
Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and method for manufacturing same
Runcang Sun, Beijing (CN); Tongqi Yuan, Beijing (CN); Xiaolong Chen, Beijing (CN); Supeng Wang, Beijing (CN); Yueying Chen, Beijing (CN); and Xianpeng Zhou, Beijing (CN)
Assigned to BEIJING FORESTRY UNIVERSITY, Beijing (CN); POWER DEKOR GROUP CO., LTD., Shanghai (CN); and HUNAN FORESTECH NEW MATERIALS CO., LTD., Zhuzhou (CN)
Filed by BEIJING FORESTRY UNIVERSITY, Beijing (CN); POWER DEKOR GROUP CO., LTD., Shanghai (CN); and HUNAN FORESTECH NEW MATERIALS CO., LTD., Zhuzhou (CN)
Filed on Oct. 18, 2021, as Appl. No. 17/504,215.
Application 17/504,215 is a continuation of application No. PCT/CN2019/118805, filed on Nov. 15, 2019.
Claims priority of application No. 201910579820.3 (CN), filed on Jun. 28, 2019.
Prior Publication US 2022/0032494 A1, Feb. 3, 2022
Int. Cl. B27N 3/00 (2006.01); B27N 3/04 (2006.01); B27N 3/18 (2006.01); C09J 175/04 (2006.01); C09J 197/00 (2006.01); C08K 3/22 (2006.01); C08K 5/3492 (2006.01)
CPC B27N 3/002 (2013.01) [B27N 3/04 (2013.01); B27N 3/18 (2013.01); C09J 175/04 (2013.01); C09J 197/005 (2013.01); C08K 3/22 (2013.01); C08K 5/34922 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a formaldehyde-free medium-high-density board capable of meeting deep facing requirements, comprising:
(1) wood chipping: cutting a wood raw material into wood chips that meet the production scale;
(2) wood screening: screening the wood chips in step (1) to remove debris, and separating oversized wood chips for further shredding;
screening the shredded wood chips to remove the debris, and separating the oversized wood chips for further shredding;
(3) cooking and softening: after screening, cooking and softening wood chips in step (2);
(4) fiber separating: putting the wood chips in step (3) into a defibrator and separating fibers mechanically;
(5) primary gluing: performing primary gluing adhesive on the fibers in step (4), where the primary gluing adhesive is a lignin adhesive;
(6) waterproof treatment: performing waterproof treatment on the fibers in step (5) after the primary gluing in step (5), and adding paraffin wax;
(7) secondary gluing: performing secondary gluing adhesive on the fibers in step (6) to obtain gluing fibers, where the secondary gluing adhesive is a MDI adhesive;
(8) drying and sorting: feeding the gluing fibers in step (7) to a drying system for drying;
(9) paving pre-pressing: paving the gluing fibers in step (8) into a slab by using a paving machine;
(10) hot pressing forming: delivering the slab to a hot pressing machine by using a loader, for pressing into a rough board;
(11) board turning cooling: feeding the rough board in step (10) into a board turning machine for cooling, stacking and curing, to a plain board;
(12) sanding polishing: after sanding, the plain board in step (11) is sawed to a board of the required size;
(13) inspection and warehousing: grading and packaging the board in step (12) according to the quality standard requirements, for warehousing; and
(14) downstream processing: in floor processing enterprises, facing decoration is performed on the board in step (13);
the formaldehyde-free medium-high-density board capable of meeting deep facing requirements is capable of implementing 20-80-filament deep facing;
the lignin adhesive comprises components with the following weight percentages:
lignin 20% to 45%;
sodium hydroxide 2.0% to 8.5%;
melamine 2% to 8%;
polyvinyl alcohol 0.2% to 1.0%;
urea 2% to 6%; and
water 40% to 70%.