US 12,337,419 B2
Ultrasonic micro-array imaging system
Roman Gr. Maev, Windsor (CA); Andrew Ouellette, Windsor (CA); and Andriy Chertov, Windsor (CA)
Assigned to Tessonics Corp., Birmingham, MI (US)
Filed by Tessonics Corp., Birmingham, MI (US)
Filed on Jul. 26, 2022, as Appl. No. 17/873,498.
Claims priority of provisional application 63/226,701, filed on Jul. 28, 2021.
Claims priority of provisional application 63/225,691, filed on Jul. 26, 2021.
Prior Publication US 2023/0029143 A1, Jan. 26, 2023
Int. Cl. B23K 31/12 (2006.01); B23K 11/30 (2006.01); G01N 29/06 (2006.01); G01N 29/07 (2006.01); G01N 29/22 (2006.01); G01N 29/28 (2006.01)
CPC B23K 31/125 (2013.01) [B23K 11/30 (2013.01); G01N 29/0654 (2013.01); G01N 29/07 (2013.01); G01N 29/221 (2013.01); G01N 29/28 (2013.01); G01N 2291/0234 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/106 (2013.01); G01N 2291/2672 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A spot-welding electrode assembly comprising:
an electrode inward of a front wall of the electrode assembly; and
a plurality of transducer elements positioned inward of the front wall of the electrode assembly.