US 12,337,407 B2
Copper alloy assembly and production method therefor
Osamu Takakuwa, Fukuoka (JP); Hisao Matsunaga, Fukuoka (JP); Takahiro Ishikawa, Toyoake (JP); Hiromitsu Uchiyama, Agui (JP); Masato Sakakibara, Handa (JP); and Masaaki Akaiwa, Handa (JP)
Assigned to Kyushu University, National University Corporation, Fukuoka (JP); and NGK INSULATORS, LTD., Nagoya (JP)
Filed by KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, Fukuoka (JP); and NGK INSULATORS, LTD., Nagoya (JP)
Filed on Jun. 26, 2023, as Appl. No. 18/341,063.
Application 18/341,063 is a continuation of application No. PCT/JP2021/049009, filed on Dec. 28, 2021.
Claims priority of application No. 2021-002418 (JP), filed on Jan. 8, 2021.
Prior Publication US 2023/0356321 A1, Nov. 9, 2023
Int. Cl. B23K 20/02 (2006.01); B23K 20/00 (2006.01); B32B 15/01 (2006.01); C22C 9/00 (2006.01); C22C 9/06 (2006.01); C22F 1/00 (2006.01); C22F 1/02 (2006.01); C22F 1/08 (2006.01)
CPC B23K 20/02 (2013.01) [B23K 20/001 (2013.01); B32B 15/01 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); C22F 1/002 (2013.01); C22F 1/02 (2013.01); C22F 1/08 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein the copper alloy bonded body has undergone solution annealing including heating at a temperature of 700 to 1100° C. for 1 to 180 minutes and an aging treatment at 350 to 550° C. for 30 to 480 minutes,
wherein a content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and wherein:
(i) a bonding interface between the members has disappeared and/or
(ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.