| CPC B23K 20/02 (2013.01) [B23K 20/001 (2013.01); B32B 15/01 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); C22F 1/002 (2013.01); C22F 1/02 (2013.01); C22F 1/08 (2013.01)] | 23 Claims |

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1. A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein the copper alloy bonded body has undergone solution annealing including heating at a temperature of 700 to 1100° C. for 1 to 180 minutes and an aging treatment at 350 to 550° C. for 30 to 480 minutes,
wherein a content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and wherein:
(i) a bonding interface between the members has disappeared and/or
(ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.
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