US D1,031,738 S
Die plate assembly for probe head
Chin-Yi Lin, Chu-Pei (TW); Keng-Min Su, Chu-Pei (TW); Che-Wei Lin, Chu-Pei (TW); and Hsin-Cheng Hung, Chu-Pei (TW)
Assigned to MPI CORPORATION, Chu-Pei (TW)
Filed by MPI CORPORATION, Chu-Pei (TW)
Filed on Jun. 28, 2021, as Appl. No. 29/796,877.
Claims priority of application No. 110300162 (TW), filed on Jan. 11, 2021.
Term of patent 15 Years
LOC (14) Cl. 14 - 02
U.S. Cl. D14—437  [D13/182]
OG exemplary drawing
 
The ornamental design for a die plate assembly for probe head, as shown and described.