US 12,016,247 B2
Package comprising an integrated passive device configured as a cap for a filter
Changhan Hobie Yun, San Diego, CA (US); Nosun Park, Incheon (KR); Daniel Daeik Kim, San Diego, CA (US); Paragkumar Ajaybhai Thadesar, San Diego, CA (US); and Sameer Sunil Vadhavkar, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Aug. 27, 2020, as Appl. No. 17/005,168.
Prior Publication US 2022/0069193 A1, Mar. 3, 2022
Int. Cl. H10N 30/00 (2023.01); H03H 9/02 (2006.01)
CPC H10N 30/1051 (2023.02) [H03H 9/02015 (2013.01); H03H 9/02535 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A package comprising:
an integrated device configured as an acoustic filter, the integrated device comprising:
a substrate comprising a piezoelectric material; and
at least one metal layer coupled to a first surface of the substrate, wherein at least part of the at least one metal layer is configured as a transducer that touches the piezoelectric material of the substrate;
an integrated passive device coupled to the integrated device, wherein the integrated passive device is configured as a cap for the integrated device configured as the acoustic filter, wherein the integrated passive device includes a metal-insulator-metal (MIM) capacitor defined by a first interconnect, an insulation layer, and a second interconnect, and wherein the MIM capacitor is located on a frontside of the integrated passive device; and
a void located between the integrated device and the integrated passive device.