US 12,016,162 B2
Electric power converter device with improved integration of cooler frame
Thomas Gradinger, Aarau Rohr (CH); Jürgen Schuderer, Zürich (CH); Felix Traub, Birmenstorf (CH); Chunlei Lui, Oberrohrdorf (CH); Fabian Mohn, Ennetbaden (CH); and Daniele Torresin, Baden (CH)
Assigned to AUDI AG, Ingolstadt (DE); and Hitachi Energy Switzerland AG, Baden (CH)
Appl. No. 17/434,546
Filed by AUDI AG, Ingolstadt (DE); and Hitachi Energy Switzerland AG, Baden (CH)
PCT Filed Feb. 25, 2020, PCT No. PCT/EP2020/054828
§ 371(c)(1), (2) Date Aug. 27, 2021,
PCT Pub. No. WO2020/173899, PCT Pub. Date Sep. 3, 2020.
Claims priority of application No. 19160101 (EP), filed on Feb. 28, 2019.
Prior Publication US 2022/0142015 A1, May 5, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20927 (2013.01) [H01L 23/473 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electric power converter device, comprising:
a first power semiconductor module;
a frame for a closed cooler,
the first power semiconductor module including
a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first main side and the second main side; and
at least one first die located on the first main side of the first base plate,
wherein the frame is attached to the second main side of the first base plate, and the first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, wherein in the first recess a first portion of the frame is received, wherein the first base plate is made of aluminum silicon carbide (AlSiC), or a combination of copper and aluminum, and the first portion of the frame is fixed to the first base plate by a welding connection which is a butt weld produced by laser welding; and
a molded encapsulation, which encapsulates the first main side and the lateral side surface of the first base plate such that a bottom surface of the encapsulation is flush with the first base plate at the circumferential edge of the first base plate on the second main side.