US 12,016,137 B2
Electronic component with cooling clearance, and assembly method
David Bruce Sarraf, Middletown, PA (US); Bernd Kosch, Bensheim (DE); and Andreas Hangauer, Bensheim (DE)
Assigned to TE Connectivity Germany GmbH, Bensheim (DE); and TE Connectivity Solutions GmbH, Schaffhausen (CH)
Filed by TE Connectivity Germany GmbH, Bensheim (DE); and TE Connectivity Services GmbH, Schaffhausen (CH)
Filed on Jul. 12, 2021, as Appl. No. 17/372,996.
Claims priority of application No. 20186153 (EP), filed on Jul. 16, 2020.
Prior Publication US 2022/0022328 A1, Jan. 20, 2022
Int. Cl. H05K 5/00 (2006.01); H05K 5/02 (2006.01)
CPC H05K 5/0026 (2013.01) [H05K 5/0213 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a circuit carrier unit having an electronic element assembled on the circuit carrier unit, the circuit carrier unit has a first section and a second section; and
a housing at least partly encompassing the circuit carrier unit, the housing has a first receiving portion receiving the first section and a second receiving portion receiving the second section, the first receiving portion and the second receiving portion are connected by at least one side wall and separated from each other by a cooling clearance having a closed proximal end near the electronic component and a distal end open to an external environment and the housing also having at least one venting aperture in the side wall placed near the closed proximal end of the cooling clearance configured to communicate between the cooling clearance and the external environment, the cooling clearance and the venting aperture being part of a cover element of the housing configured to enclose and seal the circuit carrier unit and electronic element in a watertight manner.