US 12,016,132 B2
Base material for printed circuit board and method of manufacturing base material for printed circuit board
Kayo Hashizume, Osaka (JP); and Masamichi Yamamoto, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 17/041,158
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Mar. 27, 2019, PCT No. PCT/JP2019/013276
§ 371(c)(1), (2) Date Sep. 24, 2020,
PCT Pub. No. WO2019/208077, PCT Pub. Date Oct. 31, 2019.
Claims priority of application No. 2018-085847 (JP), filed on Apr. 26, 2018.
Prior Publication US 2021/0014978 A1, Jan. 14, 2021
Int. Cl. H05K 3/38 (2006.01); H05K 1/03 (2006.01)
CPC H05K 3/382 (2013.01) [H05K 1/03 (2013.01); H05K 2201/032 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1131 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A base material for a printed circuit board comprising:
a base film having an insulating property; and
a sintered body layer including metal particles and layered on at least one surface of the base film, wherein
the sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film, and
an embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%,
wherein a contact area ratio represented by (A−B)/B·100 is greater than or equal to 0.05% and less than or equal to 0.50%, where A denotes a contact area between the base film and the sintered body layer including the metal particles, and B denotes a projected surface area of the base film.