US 12,016,115 B2
Embedded circuit board, electronic device, and fabrication method therefor
Beilei Wang, Shenzhen (CN); Weijing Guo, Shenzhen (CN); and Zhanhao Xie, Shenzhen (CN)
Assigned to SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed by SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed on Sep. 30, 2022, as Appl. No. 17/956,999.
Application 17/956,999 is a continuation of application No. PCT/CN2020/083826, filed on Apr. 8, 2020.
Prior Publication US 2023/0023144 A1, Jan. 26, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/0263 (2013.01) [H05K 1/113 (2013.01); H05K 3/103 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/07 (2013.01); H05K 2201/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An embedded circuit board, comprising:
a circuit board body;
two signal transmission layers, arranged on opposite sides of the circuit board body;
an adhesive layer, arranged between the circuit board body and at least one of the signal transmission layers, and configured to bond the signal transmission layers to the circuit board body;
one or more metal bases, embedded in the circuit board body and electrically connected to the signal transmission layers arranged on the opposite sides of the circuit board body;
a first conductive element, arranged in the adhesive layer at a position corresponding to the one or more metal bases and electrically connect the signal transmission layers to the one or more metal bases; and
a magnetic core, embedded in the circuit board body.