CPC H05K 1/0204 (2013.01) [B23K 1/0008 (2013.01); H05K 3/303 (2013.01); H05K 5/0047 (2013.01); B23K 2101/42 (2018.08)] | 20 Claims |
1. An apparatus, comprising:
an enclosure comprising a base and a lid attached to one another;
a printed-circuit-board assembly in the enclosure, the printed-circuit-board assembly comprising a printed circuit board and a plurality of electronic components attached to the printed circuit board;
a heat spreader in the enclosure, the heat spreader being a stamped sheet-metal part having a plurality of legs, each of the legs being fixedly attached to an inner main surface of the lid; and
one or more first thermal-interface-material (TIM) parts, each of the one or more first TIM parts being in contact with and vertically between the heat spreader and a corresponding one of the electronic components,
wherein the stamped sheet-metal part is shaped such that:
a first flat portion of the stamped sheet-metal part facing the inner main surface of the lid is at a first nonzero vertical distance from the inner main surface and is parallel to the inner main surface; and
a second flat portion of the stamped sheet-metal part facing the inner main surface of the lid is at a second vertical distance from the inner main surface and is parallel to the inner main surface, the second vertical distance being larger than the first nonzero vertical distance.
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