US 12,015,115 B2
Optoelectronic modules having fluid permeable channels and methods for manufacturing the same
Tobias Senn, Zurich (CH); Julien Boucart, Zurich (CH); and Susanne Westenhöfer, Wettswil (CH)
Assigned to AMS SENSORS SINGAPORE PTE. LTD., Singapore (SG)
Filed by ams Sensors Singapore Pte. Ltd., Singapore (SG)
Filed on Jan. 13, 2021, as Appl. No. 17/148,087.
Application 17/148,087 is a division of application No. 16/071,320, abandoned, previously published as PCT/SG2017/050027, filed on Jan. 19, 2017.
Claims priority of provisional application 62/280,848, filed on Jan. 20, 2016.
Prior Publication US 2021/0135077 A1, May 6, 2021
Int. Cl. H01L 33/64 (2010.01); H01L 27/146 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01S 5/0232 (2021.01); H01S 5/0236 (2021.01); H01S 5/024 (2006.01)
CPC H01L 33/648 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14685 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01S 5/0232 (2021.01); H01S 5/0236 (2021.01); H01S 5/02423 (2013.01); H01L 2933/0058 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing an optoelectronic module from a plurality of optoelectronic modules, the method comprising the steps of:
electrically mounting a plurality of active optoelectronic components to an active optoelectronic component substrate, the active optoelectronic component substrate being laterally surrounded by a spacer forming a chamber, the spacer including
an optical component mounting surface,
a fluid permeable channel formed within the spacer which comprises a fluid-permeable membrane and is operable to permit the outflow of fluids from the chamber, and
module mounting surface, and wherein an adhesive channel partially surrounds the chamber from a top view facing the optical component mounting surface, wherein the fluid-permeable channel extends into the module mounting surface;
applying an adhesive to the optical component mounting surface comprising filling the adhesive channel with the adhesive;
mounting an optical component to the optical component mounting surface;
curing the adhesive;
mounting the optoelectronic module via the module mounting surface to an adhesive substrate; and
separating the plurality of optoelectronic modules into singulated optoelectronic modules.