US 12,015,044 B2
Image sensor module and camera module including the same
Kang Jin Lee, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 4, 2022, as Appl. No. 17/592,925.
Claims priority of application No. 10-2021-0136551 (KR), filed on Oct. 14, 2021.
Prior Publication US 2023/0121510 A1, Apr. 20, 2023
Int. Cl. H01L 27/146 (2006.01); G02B 5/20 (2006.01); H01L 23/00 (2006.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01)
CPC H01L 27/14636 (2013.01) [G02B 5/208 (2013.01); H01L 24/48 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H01L 2224/48227 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An image sensor module comprising:
an image sensor; and
a substrate on which the image sensor is disposed,
wherein a step portion is provided on an upper surface of the substrate,
wherein an accommodation portion in which the image sensor is disposed is provided at the step portion,
wherein the image sensor is connected to the substrate by a bonding wire,
wherein the bonding wire is covered with a bonding portion,
wherein an inclined surface is disposed on the step portion, and a bonding pad provided at the step portion is disposed on the inclined surface, and
wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction.