US 12,015,018 B2
Semiconductor package with multiple redistribution substrates
Hyeonjeong Hwang, Cheonan-si (KR); Kyoung Lim Suk, Suwon-si (KR); Seokhyun Lee, Hwaseong-si (KR); and Jaegwon Jang, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 1, 2022, as Appl. No. 18/060,853.
Application 18/060,853 is a continuation of application No. 17/184,978, filed on Feb. 25, 2021, granted, now 11,538,798.
Claims priority of application No. 10-2020-0096713 (KR), filed on Aug. 3, 2020.
Prior Publication US 2023/0085930 A1, Mar. 23, 2023
Int. Cl. H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/50 (2013.01); H01L 2221/68372 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing semiconductor package, comprising:
forming a first redistribution substrate;
forming a second redistribution substrate in another space different from a space in which the first redistribution substrate is formed, the second redistribution substrate comprising a connection terminal formed on a bottom surface thereof;
forming a conductive structure on the first redistribution substrate;
mounting a first semiconductor chip on the first redistribution substrate, the first semiconductor chip being spaced apart from the conductive structure in a first direction;
forming a first molding layer covering the first semiconductor chip and the conductive structure;
disposing an adhesive film on the first molding layer; and
attaching the second redistribution substrate on the adhesive film,
wherein the adhesive film comprises conductive particles and the connection terminal therein,
wherein attaching the second redistribution substrate on the adhesive film comprises:
aligning the connection terminal to vertically overlap the conductive structure;
applying pressure on a top surface of the second redistribution substrate; and
applying heat to the adhesive film,
wherein the connection terminal comprises a first part and a second part that surrounds a lower portion of the first part after applying heat to the adhesive film,
wherein a maximum width of the first part of the connection terminal is less than a width of the conductive structure, and
wherein a maximum width of the second part of the connection terminal is equal to the width of the conductive structure.