US 12,014,999 B2
Integration and bonding of micro-devices into system substrate
Gholamreza Chaji, Waterloo (CA); and Bahareh Sadeghimakki, Kitchener (CA)
Assigned to VueReal Inc., Waterloo (CA)
Filed by VueReal Inc., Waterloo (CA)
Filed on Sep. 24, 2020, as Appl. No. 17/031,587.
Application 17/031,587 is a continuation of application No. 16/189,844, filed on Nov. 13, 2018, granted, now 10,818,622.
Claims priority of application No. CA 2985254 (CA), filed on Nov. 14, 2017.
Prior Publication US 2021/0020593 A1, Jan. 21, 2021
Int. Cl. H01G 11/36 (2013.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H03H 3/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/0363 (2013.01); H01L 2224/03632 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/056 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/27614 (2013.01); H01L 2224/27632 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/29609 (2013.01); H01L 2224/29611 (2013.01); H01L 2224/29639 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/80897 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83897 (2013.01); H03H 3/00 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of electrically bonding a microdevice into a receiver substrate, the method comprising:
bonding at least a part of one surface of at least one bonding pad on a receiver substrate to at least a part of another surface of at least an optoelectronic microdevice on a donor substrate,
covering a gap between the at least one bonding pad and the at least one optoelectronic microdevice with a nanowire,
coating the nanowire with a bonding material to decrease a resistance of the nanowire, and
applying a current to the at least one boding pad to decrease the contact resistance.