US 12,014,990 B2
Composite interposer structure and method of providing same
Adel Elsherbini, Tempe, AZ (US); Shawna Liff, Scottsdale, AZ (US); Johanna Swan, Scottsdale, AZ (US); and Gerald Pasdast, San Jose, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Apr. 10, 2023, as Appl. No. 18/132,865.
Application 18/132,865 is a continuation of application No. 17/536,804, filed on Nov. 29, 2021, granted, now 11,652,059.
Application 17/536,804 is a continuation of application No. 16/698,557, filed on Nov. 27, 2019, granted, now 11,270,947, issued on Mar. 8, 2022.
Prior Publication US 2023/0245972 A1, Aug. 3, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 21/304 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/5385 (2013.01) [H01L 21/3043 (2013.01); H01L 21/4846 (2013.01); H01L 24/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An interposer comprising:
a substrate comprising a glass;
a first insulator structure and first interconnects therein; and
a second insulator structure and second interconnects therein, wherein respective inorganic dielectrics of the first insulator structure and the second insulator structure adjoin each other at a material interface;
wherein first contacts, to couple the interposer to a first IC chip, are in an arrangement which spans the material interface at a first side of the interposer;
wherein second contacts, to couple the interposer to a second IC chip, are at a first surface of the first insulator structure, and are coupled to respective ones of the first contacts via the first interconnects; and
wherein third contacts, at a second side of the interposer opposite the first side, are coupled to respective ones of the first contacts via the second interconnects.