US 12,014,968 B2
Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus
Eiichirou Kishida, Kumamoto (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Nov. 22, 2022, as Appl. No. 17/992,766.
Application 17/992,766 is a continuation of application No. 17/148,224, filed on Jan. 13, 2021, granted, now 11,527,453.
Application 17/148,224 is a continuation of application No. 16/838,892, filed on Apr. 2, 2020, granted, now 10,950,515, issued on Mar. 16, 2021.
Application 16/838,892 is a continuation of application No. 15/771,547, granted, now 10,636,714, issued on Apr. 28, 2020, previously published as PCT/JP2016/078620, filed on Sep. 28, 2016.
Claims priority of application No. 2015-217638 (JP), filed on Nov. 5, 2015.
Prior Publication US 2023/0090278 A1, Mar. 23, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01)
CPC H01L 23/3114 (2013.01) [H01L 21/561 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 27/14 (2013.01); H01L 27/14687 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 2221/68327 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor element;
a transmissive material configured to be bonded with an adhesive layer to cover an optical element forming surface of the semiconductor element; and
a side surface protective resin configured to cover an entire side surface where a layer structure of the semiconductor element and the transmissive material are exposed, wherein the side surface protective resin has a portion extending upward from an upper surface of the transmissive material, and wherein the side surface protective resin has a rectangular shape in a cross-sectional view.